The main danger with the oven approach is to the plastic in the connectors on the board so it's a balancing act between the points where the solder melts and the plastic melts. I was actually surprised that the plastic endured the 200C temp. The other way would be using a hot air gun but I can imagine a bunch of smd resistors and caps get blown out of place that way so it's oven or targeted IR lamp heating.
Bookmarks