A Swiss team has created tiny, fluid-filled channels in microchips to spirit away heat and save energy
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Over the years, embedding liquid cooling in chips has been explored through three basic designs. The first two designs did not bring cooling fluid into direct contact with the chip. One used a cold plate lid with microfluidic channels to cool chips. Another featured a layer of material on the back of chips to transfer heat to a fluid-cooled plate without the lid. The third design, the one that Matioli and his team explored, brings the coolant into direct contact with the chip.
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